MediaTek has expanded its industry-leading Dimensity lineup with three new ultra-efficient chipsets, designed to enhance both high-tech and mainstream mobile devices. Complementing the flagship Dimensity 9400 and premium Dimensity 8400, the newly announced Dimensity 7400, 7400X, and 6400 offer exceptional performance in gaming, AI, photography, and connectivity.
The Dimensity 7400 and 7400X are engineered to deliver advanced gaming experiences and AI-powered camera technology. Built on TSMC’s 4 nm process, both chipsets feature an octa-core CPU with four Arm Cortex-A78 cores (up to 2. 6GHz) and four Arm Cortex-A55 cores (up to 2.0 GHz), paired with an Arm Mali-G615 MC2 GPU. These chips offer remarkable power efficiency, consuming 14% to 36% less power during gaming compared to competitors. They also integrate MediaTek’s Advanced Gaming Technology (MAGT) 3.0, which improves graphics, reduces input lag, optimizes settings through AI, and enables longer gaming sessions.
To further enhance AI capabilities, the Dimensity 7400 and 7400X include MediaTek’s NPU 6.0, delivering a 15% performance boost over the previous generation (Dimensity 7300). Photography enthusiasts will benefit from the Imagiq 950 ISP, which powers advanced AI camera features for stunning low-light photography, and supports Google Ultra HDR for richer colors, higher contrast, and improved dynamic range.
Additional highlights of the Dimensity 7400 series:
- Dimensity 7400X: Supports dual-display flip phones, giving OEMs more design versatility.
- 5G Connectivity: Equipped with a 5G Release 16 modem and 3CC carrier aggregation, these chipsets offer 20% lower power consumption thanks to MediaTek’s UltraSave 3.0+ technology.
- Wi-Fi 6E Support: Ensures fast and stable multi-gigabit wireless connectivity.
“With the Dimensity 7400 and 6400 series, we’re making premium smartphone experiences more accessible,” said Dr. Yenchi Lee, General Manager of MediaTek’s Wireless Communications Business. “From gaming to AI applications and photography, users can expect outstanding performance with impressive energy efficiency.”
MediaTek Dimensity 6400: Affordable Performance with Enhanced 5G
The Dimensity 6400, the latest addition to the affordable Dimensity 6000 series, brings advanced 5G capabilities to a wider audience. Built on TSMC’s 6 nm process, it features an octa-core CPU with two Arm Cortex-A76 cores (up to 2.5 GHz), six Arm Cortex-A55 cores (up to 2.0 GHz), and an Arm Mali-G57 MC2 GPU. This chipset delivers up to 19% lower power consumption during gaming compared to similar offerings.
Key features of the Dimensity 6400 include:
- MediaTek Bluetooth Wi-Fi HyperCoex Technology: Reduces gaming latency by up to 90%, ensuring a smoother gaming experience.
- Enhanced 5G Connectivity: Supports Release 16 Sub-6 5G modem with 2CC carrier aggregation for faster, more reliable connections.
- Improved Data Speeds: Offers up to 33% faster downlink and 18% faster uplink speeds compared to competitors.
- Stunning Visuals: Enables billion-color displays with true 10-bit images and True Color Accuracy for lifelike visuals.
- Advanced Photography: Supports 108MP cameras with MediaTek and Arcsoft’s multi-frame noise reduction (MFNR) and low pass noise reduction (LPNR) for clearer selfies and portraits.
Availability
- Smartphones featuring the Dimensity 7400 and 7400X are expected to launch in Q1 2025.
- Devices powered by the Dimensity 6400 are available now.
