GIGABYTE announced the new Z590 AORUS motherboards which support the 11th Gen Intel® Core™ processors. The new motherboards feature up to 20-phase digital power VRM design and an improved Fins-Array II heatsink design.
GIGABYTE’s Z590 AORUS lineup is geared with the best power design and thermal management to optimize overclocking performance on the upcoming 11th Gen Intel ®Core™ processors. GIGABYTE Z590 AORUS motherboards adopt up to 10 layers PCB, on the high-end models, for better heat dissipation. Moreover, the use of Daisy Chain memory routing with an anti-interference design improves the memory overclocking, stability, and overall memory performance. Selected GIGABYTE Z590 AORUS motherboards offer feature-rich I/O with an integrated I/O shield as well as the newest Thermal Guard II design, Smart Fan 6 and much more. Performance, power management, thermals, audio, GIGABYTE Z590 AORUS motherboards check all the boxes for users seeking to take their computing firepower to the next level.
Fully supports PCIe 4.0
With PCIe 4.0 support, users can enjoy the high bandwidth, the ultra-high transfer speed, and improved CPU performance on Intel platform. GIGABYTE Z590 AORUS motherboards use PCIe 4.0 grade PCBs, PCIe slots, M.2 slots, and controllers for the highest bandwidth quality, which enabling speeds up to 7000 MB/s. Z590 AORUS motherboards equip up to three PCIe 4.0 M.2 slots with direct connection to the CPU for the highest bandwidth possible. RAID configurations are possible and they could provide access rate of more than 20000 MB/s. GIGABYTE’s patent, Thermal Guard II, is a double sided heat dissipation solution that provides optimal cooling to the PCIe 4.0 M.2 SSD modules to prevent thermal throttling under high-speed operation.
Support for single-slot 32GB memory
Aside from power and thermal management, GIGABYTE Z590 AORUS motherboards boast an impressive memory configuration with support for single-slot 32GB memory capacity. The memory circuits are embedded within the PCB ground layers while the metal outer layer of the PCB reduces electromagnetic interference so those using dual channel configuration can enjoy high-speed, stable overclocked RAM performance boost above XMP 5000MHz. GIGABYTE Z590 AORUS XTREME features the exclusive SMT Memory DIMM design which utilizes surface adhesion welding technology so that the solder joints of the memory slots are smoothly fixed onto the PCB. This reduces signal interference between the open fiber cloths of the PCB and the memory wiring. The signal stabilizing function of the tantalum Polymer capacitors at the base of the memory slots further enhance the stability of the board especially when overclocking at XMP high frequencies.
Built-in ESS SABRE
When it comes to audio, GIGABYTE is always on top of the game. The top of GIGABYTE Z590 lineup utilizes a high SNR audio engine and pairs it with the WIMA FKP2 studio-grade audio capacitors to deliver studio-grade and high-fidelity audio. The GIGABYTE exclusive audio design integrates ESS SABRE DAC as well as DTS：X® Ultra to deliver high fidelity audio for the most immersive sound experience whether it’s for gaming or watching movies/listening to music. The flagship Z590 AORUS XTREME motherboard introduces the ESSential USB DAC, a USB Type C interface with built-in ESS SABRE HiFi ES9280C PRO.
