MediaTek is taking center stage at Mobile World Congress (MWC) 2025 with groundbreaking advancements in next-generation wireless technology. The company is presenting innovations that pave the way for 6G, including hybrid computing, a live low Earth orbit (LEO) broadband NR-NTN trial, sub-band full duplex (SBFD), and the latest M90 5G Advanced modem.
MediaTek is also unveiling new developments in its Dimensity Auto and Dimensity Smartphone SoCs, with cutting-edge devices from leading brands showcased at its booth in Hall 3.
“Our commitment to advancing global connectivity and AI innovation continues to open new opportunities that enhance everyday life,” said Joe Chen, President of MediaTek. “With our latest breakthroughs in 6G technologies, generative AI hybrid computing, and 5G-Advanced solutions, we are shaping the future of wireless communication.”
Table of Contents
- 1 Pioneering 6G with Integrated Communications & Computing
- 2 Ultra Power-Efficient Envelope Assisted RFFE for Next-Gen Wireless
- 3 Advancing 6G with Sub-Band Full Duplex
- 4 Introducing the MediaTek M90 5G Advanced Modem
- 5 Generative AI Gateway: Bringing AI to Every Device
- 6 Expanding Satellite Connectivity with 5G-Advanced NTN
- 7 MediaTek Dimensity Auto: Powering Next-Gen Vehicles
- 8 Flagship Performance with Dimensity 9400
- 9 224G SerDes: Driving the Future of AI and Data Centers
Pioneering 6G with Integrated Communications & Computing
MediaTek is demonstrating its Hybrid Computing innovation, a key component of future 6G standardization. This technology integrates device, cloud, and RAN (Radio Access Network) as an ‘edge cloud’, ensuring ultra-low latency for applications like Generative AI, carrier-grade privacy, and dynamic computing resource management. Collaborations with NVIDIA, Intel, and G REIGNS bring these advancements to life.
Ultra Power-Efficient Envelope Assisted RFFE for Next-Gen Wireless
The Envelope Assisted RFFE System boosts power amplifier efficiency by 25%, minimizing heat generation while expanding bandwidth by over 100MHz within the same power envelope. This allows for higher power output and broader network coverage.
Advancing 6G with Sub-Band Full Duplex
MediaTek is showcasing Sub-Band Full Duplex (SBFD), a crucial technology for 5G-Advanced and 6G. SBFD enhances unpaired TDD spectrum efficiency, significantly improving uplink coverage and reducing latency. Partnering with Keysight, MediaTek has achieved a major breakthrough by mitigating self-interference, a challenge in compact devices like smartphones.
Introducing the MediaTek M90 5G Advanced Modem
The new M90 5G-Advanced modem delivers speeds of up to 12Gbps, supports 3GPP Release 17 and 18, and features Smart Antenna technology powered by AI to optimize data throughput. Utilizing MediaTek UltraSave technology, it reduces power consumption by 18% compared to previous models.
During MWC 2025, MediaTek will demonstrate an industry-leading 10Gbps throughput on a live Ericsson network, leveraging FR1 3CC + FR2 8CC connectivity.
Smart AI Antenna for Enhanced Connectivity
The Smart AI Antenna feature enables body proximity sensing without external sensors, optimizing signal quality based on how the device is held and its network environment. MediaTek will showcase this innovation in partnership with Anritsu.
Generative AI Gateway: Bringing AI to Every Device
MediaTek is revolutionizing Generative AI with a Gateway and Context Synchronization system that extends AI capabilities beyond smartphones and smart home devices. This technology enables decentralized AI processing, ensuring enhanced device functionality while maintaining data privacy and security.
At MWC 2025, MediaTek will also highlight next-generation CPE devices featuring:
- 1.9x uplink performance boost with three transmission antennas (3TX)
- Low-Latency, Low-Loss, and Scalable throughput (L4S), reducing network latency by 20x
Expanding Satellite Connectivity with 5G-Advanced NTN
MediaTek continues to lead in 5G-Advanced Non-Terrestrial Network (NTN) technology, unveiling its Ku-band NR-NTN solution for seamless broadband connectivity on 5G devices.
Following a successful Ku-band NR-NTN field trial over OneWeb’s LEO satellite network, MediaTek partnered with Eutelsat, AIRBUS, ITRI, Sharp, and Rohde & Schwarz to demonstrate its cutting-edge satellite communication capabilities.
MediaTek Dimensity Auto: Powering Next-Gen Vehicles
MediaTek is showcasing Dimensity Auto, a high-performance automotive platform designed for multimedia, 3D graphics, and AI processing across multiple virtual machines (VMs). The innovative eCockpit supports 8K displays, offering a next-generation in-vehicle experience in collaboration with strategic partners.
Flagship Performance with Dimensity 9400
The Dimensity 9400 5G chipset is powering the latest smartphones, bringing AI-driven photography, videography, and gaming innovations. Demonstrations include:
- AI Audio Focus & AI Telephoto
- Best Snapshot & AI Depth Engine for video playback
- Ray-traced graphics for immersive gaming
224G SerDes: Driving the Future of AI and Data Centers
MediaTek’s 224G SerDes technology delivers industry-leading performance, reliability, and efficiency for AI, hyperscale computing, and networking infrastructure. By collaborating with major foundries, MediaTek optimizes chip-to-chip interconnect, high-speed I/O, and ultra-large package design to meet the demands of future AI and cloud-based applications.
Experience MediaTek at MWC 2025
Discover MediaTek’s latest innovations by visiting booth #3D10 at MWC 2025 or learn more at www.mediatek.com.
