G.SKILL has announced a groundbreaking DDR5 memory kit with an ultra-high capacity of 256 GB (64 GB x4), running at an overclocked speed of DDR5-6000 with low-latency CL32 timings.
Enhanced by premium SK hynix DDR5 ICs, this release marks a major advancement in memory performance and capacity, perfectly suited for power users, content creators, demanding AI applications, and high-end workstations. Additionally, G.Skill unveiled a 128 GB DDR5-7000 model not too long ago.
Ultra-Capacity Meets Speed: DDR5-6000 CL32, 256 GB Kit
As the demand for high-capacity, high-speed memory increases—especially in fields like AI, 3D rendering, and high-resolution video editing—G.SKILL’s new kit addresses those needs head-on.
Equipped with AMD EXPO overclocking profiles, this 256 GB (64 GB x4) DDR5-6000 CL32 kit has been successfully validated on systems featuring the ASUS ROG CROSSHAIR X870E HERO with an AMD Ryzen™ 7 9800X3D processor, and the MSI MPG X870E CARBON WIFI paired with an AMD Ryzen™ 9 9900X.
Pushing the Limits: Overclocked to DDR5-7000 CL38
Through intensive R&D, G.SKILL has also demonstrated the overclocking ceiling of these ultra-dense modules. When installed on the MSI MEG X870E GODLIKE motherboard and powered by the AMD Ryzen™ 7 9800X3D, the 256 GB kit achieved a blistering DDR5-7000 CL38-50-50—an impressive feat for such high-capacity memory.
Low-Latency Performance at DDR5-6400 CL32
In addition to top-tier speed, the new 256 GB kit showcases outstanding low-latency performance, operating at DDR5-6400 CL32. This configuration was tested on both the ASUS ROG CROSSHAIR X870E HERO with Ryzen™ 9 9900X3D and the MSI MAG B850M MORTAR WIFI with Ryzen™ 7 9800X3D, reinforcing the kit’s flexibility and stability across high-end platforms.
