TEAMGROUP to Unveil AI Innovations at Computex 2024

Team Group Inc., a leading provider of premium storage solutions, returns to COMPUTEX 2024 with the theme “Elevate Gaming, Empower AI.”

From June 4-7, TEAMGROUP will showcase a variety of flagship products at Booth I 0118 in the Taipei Nangang Exhibition Center. Highlights include high-performance memory, cooling solutions, large-capacity storage devices, and advancements in industrial automation, with a special focus on AI applications.

Key Product Highlights:

1. T-FORCE XTREEM DDR5 Memory Module: Featuring exclusive overclocking capabilities up to 10,000 MHz, enhanced thermal management, and stylish new designs in Fuji White and Diamond Rose, this module is geared towards gamers seeking top-tier performance.
2. T-FORCE GE PRO Gen5 M.2 PCIe SSD and T-FORCE DARK AirFlow 5 SSD Cooler: This high-end SSD achieves read/write speeds up to 14,000/11,800 MB/s. Paired with an advanced cooling system, it offers superior thermal regulation and performance monitoring via TEAMGROUP’s S.M.A.R.T. software.
3. T-CREATE EXPERT Ai CKD DDR5 Memory Module: Optimized for AI applications, this module delivers high frequency, wide bandwidth, and low latency. It includes advanced cooling solutions and new CKD components for improved performance.
4. T-CREATE EXPERT Ai CAMM2 Memory Module: Designed for AI laptops, this module features high frequencies, large capacities, and patented ultra-thin graphene heat sinks, ensuring stable performance during intensive tasks.
5. T-CREATE I54 Ai Gen5 M.2 PCIe SSD: Tailored for AI content creation, this SSD offers high bandwidth, low latency, and efficient thermal regulation, enhancing power efficiency and performance.
6. T-CREATE CinemaPr P31 and R41: These professional filming solutions include an external SSD and a CFexpress 4.0 card reader, providing high transfer speeds and compatibility with various devices, facilitating seamless integration for photographers and videographers.
7. T-FORCE DELTA RGB ECO DDR5 Memory Module: Emphasizing environmental sustainability, this module is made from recycled materials and reduces carbon emissions significantly, aligning with TEAMGROUP’s eco-friendly initiatives.
8. TEAMGROUP PD20 ECO Mini External SSD: This compact SSD, made from post-consumer recycled plastics, offers high storage capacity and transfer speeds, reflecting TEAMGROUP’s commitment to environmental stewardship.
9. TEAMGROUP INDUSTRIAL CXL 2.0 Server Memory Module: Addressing the demands of AI and HPC systems, this module enhances memory resource efficiency with advanced heat dissipation technology.
10. TEAMGROUP INDUSTRIAL Ultra-Wide Temperature Storage Solutions and WORM Secure Encrypted Card: These solutions provide reliable performance in extreme conditions and enhanced data security for industrial applications.

TEAMGROUP’s latest innovations at COMPUTEX 2024 highlight their dedication to advancing technology in gaming and AI, underscoring their position as industry pioneers. Visit Booth I 0118 to explore these groundbreaking products firsthand.